February 23, 2021: Nexperia, an expert in the field of key semiconductor devices, today announced the launch of a series of half-bridge (high-end and low-end) automotive MOSFETs using space-saving LFPAK56D packaging technology. A half-bridge configuration using two MOSFETs is a standard building block for many automotive applications, including motor drivers and DC/DC converters. This new package provides a single-device half-bridge solution. Compared with the dual-channel MOSFET used in the three-phase motor control topology, the PCB area is reduced by 30% due to the removal of the PCB circuit, while supporting simple automatic optical inspection (AOI) during the production process. LFPAK56D half-bridge products adopt the existing high-volume LFPAK56D packaging process and have mature automotive-grade reliability. This type of package uses flexible pins to improve overall reliability, and the internal copper clip connection between MOSFETs simplifies the PCB design and brings a plug-and-play solution. The current handling capacity reaches 98A, which is very good. .
Generally, in a half-bridge structure, the PCB connection between the source of the high-side MOSFET and the drain of the low-side MOSFET generates a large amount of parasitic inductance. However, through the internal clip-on connection, the LFPAK56D half-bridge package has successfully reduced parasitic inductance by 60%.
The newly introduced LFPAK56D half-bridge MOSFETs are BUK7V4R2-40H and BUK9V13-40H. Both products use the highly durable Trench 9 automotive-grade wafer process technology, with a rated voltage of 40 V, and have passed twice the verification of the automotive AEC-Q101 specification in key tests. The RDS(on) of these two devices are 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13) respectively.
The Nexperia LFPAK56D half-bridge package product that meets the AEC-Q101 standard is suitable for various three-phase automotive power system applications, such as fuel pumps, water pumps, motor control, and DC/DC power conversion. The occupied PCB area is reduced by 30%, and the parasitic inductance is reduced by 60%, so it is suitable for high-performance switching applications. With the design adoption and investment of important automotive customers, this new technology has achieved success.
For more information, including product data sheets and quick learning videos, please visit www.nexperia.com/lfpak56d-half-bridge
About Nexperia
Nexperia, as a high-capacity production expert in the field of semiconductor basic component production, its products are widely used in various Electronic designs around the world. The company’s rich product portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFET devices, gallium nitride field effect transistors (GaN FETs), and analog and logic ICs. Headquartered in Nijmegen, the Netherlands, Nexperia can deliver more than 90 billion products each year, and the products meet the stringent standards of the automotive industry. Its products have been widely recognized by the industry in terms of efficiency (such as process, size, power and performance), and have advanced small-size packaging technology that can effectively save power and space.
With decades of professional experience, Nexperia continues to provide high-quality companies around the world with efficient products and services, and has more than 12,000 employees in Asia, Europe and the United States. Nexperia is a subsidiary of Wingtech Technology Co., Ltd. (600745.SS). It has a large intellectual property portfolio and has obtained IATF 16949, ISO 9001, ISO 14001 and OHSAS 18001 certifications.
Nexperia: Efficiency wins.
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