Thursday, August 29, 2019

MT506LV4CN

Eview MT506LV4CN New TOUCH PANEL, MT506LV4CN pictures, MT506LV4CN price, MT506LV4CN supplier 
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Email: sales@shunlongwei.com

https://www.slw-ele.com/mt506lv4cn.html
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Install Environment

Where Used


The MT-500 Series is designed for use in a factory environment. It is designed to
operate from 32 to 113 °F (0 to 45 °C) temperatures, as found in most industrial
environments. It may not be suitable for use in certain outdoor applications. Please
consult the factory for advised usage in outdoor applications.
 

NEMA Rating


The MT-500 Series front bezel is NEMA 4 rated. When installed properly in a NEMA
4 panel, the NEMA 4 rating of the panel will not be compromised. This means that
fluids will not enter the panel during wash downs.
 

Electrical Environment


The MT-500 Series has been tested to conform to European CE requirements. This
means that the circuitry is designed to resist the effects of electrical noise. This does
not guarantee noise immunity in severe cases. Proper wire routing and grounding
will insure proper operation.
 

Mechanical Environment


Avoid installing units in environments where severe mechanical vibration or shocks
are present. 

Panel Details


The unit can be mounted into panels with a depth of 4” (105mm). It is recommended that the unit be mounted on the front panel of a steel enclosure, through an appropriate opening*. Allow a clearance of 1”(25mm) around the sides of the unit for mounting hardware. Allow clearance for cable connections to the back of the unit. Unit depth may vary according to cable type used. Typically, plan a depth to accommodate at least 4” (105mm) behind the panel.

NEMA-4 Mounting


Put the unit through the panel cut out. Slide the clamps into the 6 holes provided around the case. Tighten the clamping screws in an even pattern until the unit is secured in the panel.

Thursday, August 8, 2019

G190ETN01.0

AUO G190ETN01.0 New G190ETN01.0 AUO 19.0 inch Panel 1280×1024 1000:1 16.7M WLED LVDS , G190ETN01.0 pictures, G190ETN01.0 price, G190ETN01.0 supplier
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Email: sales@shunlongwei.com
https://www.slw-ele.com/g190etn010.html
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Panel Brand : AUO Panel Model : G190ETN01.0
Panel Type : a-Si TFT-LCD ,
Panel Panel Size : 19.0 inch
Resolution : 1280(RGB)×1024 , SXGA
Display Mode : TN, Normally White, Transmissive
 Active Area : 376.32×301.06 mm
Outline : 396×324×11.7 mm
Surface : Antiglare, Hard coating (3H)
Brightness : 350 cd/m² (Typ.)
Contrast Ratio : 1000:1 (Typ.) 
Display Colors : 16.7M   (6-bit + Hi-FRC) , CIE1931 72% 
Response Time : 3.6/1.4 (Typ.)(Tr/Td)
Viewing Angle : 85/85/80/80 (Typ.)(CR≥10) (L/R/U/D)
Frequency : 60Hz  Lamp Type : 12S4P WLED     
Without DriverSignal Interface : LVDS (2 ch, 8-bit) , 30 pins  Input Voltage : 5.0V (Typ.)   G190ETN01.0


G190ETN01.0 inverter, G190ETN01.0 power supply, G190ETN01.0 electronic board, G190ETN01.0 VGA board, G190ETN01.0 touchscreen available.

NL6448BC33-59

NL6448BC33–59

NEC NL6448BC33–59 New NEC 10.4inch Panel 640×480 450 600:1 262K CCFL , NL6448BC33–59 pictures, NL6448BC33–59 price, NL6448BC33–59 supplier
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Email: sales@shunlongwei.com

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Panel Brand : NEC
Panel Model : NL6448BC33–59 1 Compatible model
Panel Type : a-Si TFT-LCD , Panel
Panel Size : 10.4 inch
Resolution : 640(RGB)×480 , VGA
Display Mode : TN, Normally White, Transmissive
Active Area : 211.2×158.4 mm
Outline : 243×185.1×10.5 mm
Surface : Clear, Hard coating (3H)
Brightness : 450 cd/m² (Typ.)
Contrast Ratio : 600:1 (Typ.)
Display Colors : 262K (6-bit)
Response Time : 8/25 (Typ.)(Tr/Td)
Viewing Angle : 70/70/45/55 (Typ.)(CR≥10) (L/R/U/D)
Frequency : 60Hz
Lamp Type : 2 pcs CCFL
Signal Interface : CMOS (1 ch, 6-bit)

Input Voltage : 3.3/5.0V (Typ.)

EQUESTRIAN STORY 3

Whether it is in daily life or practicing equestrian, the most important thing is self-control. If you can't control yourself, there are more goals, and more methods are useless. (Equestrian helmet)

Equestrian helmet
 
Focus on time step by step
 
This is often the case. If you concentrate on horseback riding for half an hour, you may be able to do it easily, but if you let you ride for two hours, you may think that it is very painful. If you can concentrate on the best training in half an hour, set the training time to half an hour and then set it to forty minutes in a few days. After waiting for forty minutes, then increase to fifty minutes...
 
This step by step, you will find that your focus on training is getting longer and longer, people's potential is unlimited, there is no bad thing, sometimes it may be the wrong way. (Equestrian helmet)
 
Control your emotional state of mind
 
When a good equestrian athlete finishes a game with his own horse, he not only has to make his own technical movement standards and norms, but more importantly, he controls his emotions and mentality, and always maintains concentration, calm and optimism.
 
If the rider is worried, his horse will be nervous; if the rider is impatient, his horse will be stiff. Often the rider's bad attitude appears and is quickly transmitted to the horse. In this case, the state of the horse will be affected, and even the situation will be violent and uncontrolled.
equestrian helmet
 
Develop a proactive willpower
 
Don't confuse willpower with self-denial, and when it's applied to aggressive equestrian goals, it will become a huge force. Active willpower allows you to overcome the inertia of training and focus your attention on future goals. When you encounter resistance, imagine yourself being happy after overcoming it; actively commit yourself to the specific practice of achieving your goals, and you can stick to it. (helmet wholesale)
 
A person who can control his own mood in equestrian and control the horse he sat down, I believe that in normal life and work, he can certainly achieve self-denial, stay focused, and control his emotional fluctuations.

Tuesday, August 6, 2019

HORSING FOR CHILDREN

Learning to ride horses, children have an advantage over adults. (Equestrian Helmet)
 
First of all, children do not have psychological burdens and are more likely to relax. Adults need some psychological comfort when they are new to school. Coaches often help adults to let go of their burdens.
 
Secondly, the child's flexibility is good and the degree of bumpiness is low. Because the body is relatively soft and the weight is small, the child's bumpiness during riding is much smaller than that of adults.
 
For children, learning to ride a horse is not necessarily a level of achievement. Equestrian is the means of education, not the purpose. Horseback riding is a communication skill rather than a driving. (helmet wholesale)
 
Exercise balance
 
Riding is a sport that can balance the sense of balance. For beginners, whether sitting on horseback or learning some basic equestrian movements, it is very beneficial to balance the exercise.
 
Shape the graceful posture
 
Since riding a chest and straightening the waist, you can get rid of the bad habits of bending back and forth by learning the basic posture of riding. Moreover, the riding is a movement of vertical lines, and if it can be adhered for a long time, it can slowly form a beautiful posture. This is why Western aristocratic families require women to learn to ride horses at an early age, which can create a princess-like temperament. (equestrian helmet)

equestrian helmet
 
Exercise coordination
 
Riding is a full-body exercise, and the skill is greater than strength. The rider's hand-eye coordination is required during the riding process, so it is very helpful for the overall coordinated exercise of the body.
 
Cultivate excellent quality
 
In the interaction with the horse, you can slowly cultivate love, courage, patience and wisdom, which not only enhances emotional intelligence, but also enhances their confidence in overcoming obstacles.
Equestrian Helmet
 
 
Improve communication skills
 
The first thing to learn about equestrian is to communicate and cooperate with animals. To know what the horse thinks, let the horse know what he wants. When a child comes into contact with an animal through body language, he will slowly learn to experience others and learn to express and communicate. This is why riding can be one of the treatments for autism.
 
Pleasant body and mind
 
When the child rides on the horse, you can feel the joy and excitement. Some children may still be afraid at first, but after overcoming the fear, they can slowly feel the novelty and comfort brought by riding. And riding is a combination of active and passive sports. Compared with other competitive sports, riding will make children more relaxed and enjoy more happiness. (equestrian helmet)
 

Monday, August 5, 2019

COMMON PROBLEMS AND SOLUTIONS IN IGBT APPLICATIONS

The igbt, which combines the advantages of gtr and mosfet, is a new type of insulated gate bipolar transistor that was introduced in the 1980s. It has convenient control, high operating frequency, fast switching speed and large safe working area. With the continuous improvement of voltage and current levels, igbt has become an ideal power switching device for high-power switching power supplies, variable frequency speed regulation and active filters, and has been widely used in power electronic devices.
 
With the development of high-frequency and high-power of modern power electronics technology, the potential problems of switching devices are becoming more and more prominent in the application. The voltage and current overshoot caused by the switching process affect the working efficiency and reliable operation of the inverter. Sex. In order to solve the above problems, measures such as overcurrent protection, heat dissipation, and reduction of line inductance have been actively adopted. The snubber circuit and soft switching technology have also been extensively studied and rapid progress has been made. This article reviews this aspect.
 
igbt application areas
 
2.1 Application in frequency converter
 
The block diagram of the spwm variable frequency speed control system is shown in Figure 1. The main circuit is a standard topology circuit of a voltage source type spwm inverter with igbt as a switching element. The capacitor is charged by a rectifier circuit, and the spwm signal generated by the control circuit controls the output waveform of the inverter through the driving circuit; The three-phase AC voltage of the corresponding frequency, amplitude and phase sequence is output to the asynchronous motor to operate at a certain speed and direction of rotation.
 
 
2.2 Application in switching power supply
 
Figure 2 shows a block diagram of a typical ups system. Its basic structure is a set of rectifiers and chargers that convert alternating current into direct current and inverters that convert direct current into alternating current. The battery stores energy when the AC power is normally supplied and maintains a normal charging voltage, and is in a "floating state". Once the power supply is out of the normal range or interrupted, the battery immediately supplies power to the inverter to ensure that the ups power supply outputs an AC voltage.
 
 
The main control object in the ups inverter power supply is the inverter, and the most widely used control method is the sinusoidal pulse width modulation (spwm) method.
 
2.3 Application in active filters
 
 
2.2 Application in switching power supply
 
Figure 2 shows a block diagram of a typical ups system. Its basic structure is a set of rectifiers and chargers that convert alternating current into direct current and inverters that convert direct current into alternating current. The battery stores energy when the AC power is normally supplied and maintains a normal charging voltage, and is in a "floating state". Once the power supply is out of the normal range or interrupted, the battery immediately supplies power to the inverter to ensure that the ups power supply outputs an AC voltage.
 
The main control object in the ups inverter power supply is the inverter, and the most widely used control method is the sinusoidal pulse width modulation (spwm) method.
 
2.3 Application in active filters
 
The schematic diagram of the parallel active filter system is shown in Figure 3. The main circuit is an inverter with igbt as the switching element, which injects the reverse harmonic value into the system, and theoretically can completely filter out the harmonics existing in the system. Different from the frequency converter, the modulated wave of the active filter pwm control signal is a composite waveform of each harmonic that needs to be compensated. In order to accurately reflect the harmonic components of the modulated wave, the carrier must be greatly improved. Frequency of. This also places higher demands on the switching frequency of the switching device.
 
Analysis of common problems in 3 igbt applications
 
Obviously, igbt is applied to various systems as a switching element of an inverter, and the commonly used control method is the pwm method. Both theoretically and in fact, it has been proved that if the switching frequency of the pwm inverter is increased above 20khz, the noise of the inverter will be smaller, the volume will be smaller, the weight will be lighter, and the output voltage waveform will be more sinusoidal. It can be seen that high frequency is the development direction of inverter technology. However, in a typical pwm inverter, the switching device is turned on at a high voltage, turned off at a large current, and is in a forced switching process. When operating at a high switching frequency, it is limited by a series of factors:
 
(1) Generate a holding effect or dynamic holding effect
 
Igbt has a four-layer structure, so that there is a parasitic thyristor in the body, and the equivalent circuit is shown in Figure 4. There is a body short circuit rs between the base and the emitter of the npn tube. The lateral hole flow of the p-type body region will produce a certain voltage drop, which is equivalent to a positive bias voltage for j3. Within the specified range, this positive bias voltage is not large and the npn tube will not conduct. When ic is greater than a certain degree, the positive bias voltage is sufficient to turn on the npn transistor, so that the npn and pnp transistors are in a saturated state, so that the parasitic thyristor is turned on, and the gate loses control, that is, the holding effect, which increases ic. Causes excessive power consumption and even damage to the device. An increase in temperature will cause a serious drop in the icm that the igbt will hold.
 
In the dynamic process of igbt turn-off, if the dvce/dt is higher, the displacement current cj2dvce/dt caused in the j2 junction is larger. When the current flows through the body short-circuit resistance rs, it can generate enough for the npn transistor to be turned on. The forward bias voltage satisfies the conditions of the parasitic thyristor turn-on and forms a dynamic holding effect. An increase in temperature will increase the risk of igbt's dynamic holding effect.
 
(2) Excessive di/dt causes voltage overshoot at the time of switching through the line inductance between igbt and the snubber circuit
 
The circuit is analyzed with the line inductance lб≠0. As shown in Figure 5, during the turn-off process, the inductive load current iб remains unchanged, ie iб=it+id remains unchanged, and it increases from zero to iб. Since diode d is turned on, vee=0, since it linearly decreases with time, the induced voltage vl=vbc=lбdit/dt at both ends of the inductor lб should be a negative value, and vb is a positive value, that is, the potential at point c is higher than the potential at point b. .
 
Since it=i0(1-t/tfi)
 
Therefore vl=vbc=lбdit/dt=-lбi0/tfi“0
 
Vcb= -vbc= lбi0/tfi
 
During the tfi of its falling, the voltage across the switch
 
Vt=vcem=vd-vl=vd+lбi0/tfi
 
Therefore, at the beginning of the shutdown process, vt immediately rises from zero to vcem, and during the period from i0 to zero, vt=vcem does not change. Until it=0, id=i0, vt drops to the power supply voltage vd, as shown in Figure 5(b). The value of vcem over vd depends on lб, tfi and load current i0. Obviously, too fast current drop rate di/dt (ie tfi is small), excessive stray inductance lб or excessive load current will cause serious components when shutting down. Overvoltage, and with a lot of power consumption.
 
It can be seen that although the fast turn-on and turn-off of igbt is beneficial to shorten the switching time and reduce the switching loss, too fast turn-on and turn-off are harmful under large inductive load. When turned on, there is a freewheeling diode reversal. The recovery current and the discharge current of the snubber capacitor, the faster the turn-on, the larger the peak current that igbt is subjected to, and even rises sharply, causing damage to the igbt or freewheeling diode. When turned off, the large inductive load turns on and off with the overspeed of igbt, which will generate a high-frequency, high-amplitude, narrow-width spike voltage ldi/dt in the circuit. The conventional over-voltage snubber circuit is exposed to the diode. The limit is difficult to absorb the spike voltage, so vce suddenly rises to produce overshoot, and igbt will withstand higher dvce/dt impact, which may cause damage to other components in the circuit or itself due to overvoltage breakdown.
 
(3) The state of operation of the switching device at the moment of turn-on and turn-off is beyond the reverse safe working area (rbsoa);
 
The reverse safe working area (rbsoa) is surrounded by three limit boundary lines of maximum collector current icm, maximum collector pole voltage vce and voltage rise rate dvce/dt, and is added with dvce/dt when igbt is turned off. Change, the higher the dvce/dt, the narrower the rbsoa, so the high dvce/dt generated at the turn-on and turn-off moments will make the state of the switching device more easily beyond the rbsoa, affecting the switch reliability.
 
(4) The surge voltage when dv/dt and igbt are turned off during diode reverse recovery will cause overcurrent during switching.
 
It is well known that igbt has a Maitreya capacitor ccg and an input capacitor cge. The voltage overshoot across igbt will pass through the ccg coupling gate, causing the gate voltage to rise instantaneously because of the gate negative bias and the input capacitor cge. The height reached by the voltage is much lower than the overshoot of the collector, but it may exceed the threshold and cause the tube that should be turned off to conduct, so the upper and lower arms are straight through and overcurrent.
 
If the resulting gate voltage is sufficient to saturate the tube, it is not through but shorted. This overcurrent or short circuit also appears repeatedly in the oscillation decay process after the collector voltage overshoot. Experiments prove that this phenomenon does exist.
 
4 commonly used solutions
 
For the above problems, the practical measures generally adopted are: selecting an effective overcurrent protection circuit, using a non-inductive line, actively dissipating heat, using an absorption circuit and a soft switching technique.
 
4.1 Select an effective overcurrent protection drive circuit
 
In igbt applications, the key is overcurrent protection. The overcurrent time that igbt can withstand is only a few microseconds, which is much smaller than that of devices such as scr and gtr (tens of microseconds), so the requirement for overcurrent protection is even higher. Igbt's overcurrent protection can be divided into two types, one is low multiple (1.2~1.5 times) overload current protection;
 
The other is high-multiplier (8~10 times) short-circuit current protection. For overload protection, protection can be achieved by instantaneously blocking the gate pulse. For the short-circuit current protection, adding the instantaneous blocking gate pulse will be too large due to the di/dt of the short-circuit current drop, and it is easy to induce a high collector voltage to pass through the igbt on the loop stray inductance, so that the protection fails.
 
Therefore, for igbt, reliable short-circuit current protection should have the following characteristics:
 
(1) First, the gate voltage should be softly lowered to limit the peak value of the short-circuit current, prolong the allowable short-circuit time, and win the time for the protection action;
 
(2) Protection to cut off the short-circuit current should be implemented with soft shutdown
 
The igbt drivers exb841, m57962 and hl402b meet the above requirements. However, these drivers cannot completely block the pulse. If no measures are taken, the soft-off protection of each cycle will be caused once the fault does not disappear. The heat accumulation thus generated will still cause damage to the igbt. To this end, the fault detection output of the driver can be used to completely block the gate pulse through the optocoupler, or reduce the operating frequency to below 1hz, and automatically return to the normal operating frequency when the fault disappears.
 
As shown in Figure 6, the igbt driver module m57962l has its own protection function. When the detection circuit detects that the detection input pin 1 is 15v high level, it determines that it is a current fault, immediately starts the gate shutdown circuit, and sets the output terminal 5 pin. Low level, make igbt cut off, and output error signal to make the fault output terminal 8 low level, to drive the external protection circuit to work, delay 8~10μs to block the drive signal, which can achieve overcurrent protection well. After a delay of 1~2ms, if the input is detected as high level, m57962l is reset to the initial state.
 
 

Saturday, August 3, 2019

IGBT know ledge 3

IGBT (Insulated Gate Bipolar Transistor) is a minority carrier device with high input impedance and strong current carrying capacity. From the circuit designer's point of view, IGBT has input characteristics of MOS devices. And the current output capability of the bipolar device is a voltage-controlled bipolar device. The purpose of the invention of the IGBT is to combine the advantages of the power MOSFET and the BJT device. It can be said that the IGBT is a combination of the power MOSFET and the BJT. The avatar of one. The advantages of both are concentrated in one and can have excellent performance.
 
IGBTs are suitable for many applications in power circuits, especially PWM drives, three-phase drives, which require high dynamic control and low noise. Other applications such as UPS, switching power supplies, etc. that require high switching frequency are also suitable for IGBTs. The IGBT is characterized by high dynamic performance, conversion efficiency, and low audible noise. It is also suitable for resonant mode inverter/inverter circuits. There are IGBTs optimized for low conduction loss and low switching loss. Device.
 
The main advantages of IGBTs for power MOSFETs and BJTs are as follows:
 
1. Has a very low on-voltage drop and excellent on-current density. Therefore, smaller size devices can be used to reduce costs.
 
2. Because the gate structure uses the same design of the MOS tube, the driving power is very small, and the driving circuit is also very simple. Compared with the thyristor/BJT current control type devices, the IGBT is very easy in high voltage and high current application scenarios. control.
 
3. It has better current conduction capability than BJT. The parameters are better in forward and reverse isolation.
 
In addition to its advantages, IGBTs have their shortcomings:
1. The switching speed is lower than the power MOSFET, but higher than BJT. Because it is a minority carrier device, the collector current residual causes the shutdown speed to be slower.
 
2. Because of the internal PNPN type thyristor structure, there is a certain probability that it will be locked.
 
The advantage of IGBTs is the ability to enhance voltage isolation. For example, for MOSFETs, as the breakdown voltage increases, the on-resistance increases very quickly because the thickness of the drift region and its own resistance must increase in order to increase the breakdown voltage. In practice, MOSFETs with high current carrying capacity and high breakdown voltage are generally not designed. For IGBTs, because of the highly concentrated injection of minority carriers during turn-on, the resistance of the drift region is greatly reduced. The forward voltage drop of the zone is only related to its thickness and is relatively independent of its own resistance.
 
basic structure
Figure 1 shows a simplified schematic of a typical N-channel IGBT fabricated using the DMOS process. This structure is just one of many possible configurations. It can be seen that in addition to the P+ implant layer, the silicon cross-over and vertical power MOSFET of the IGBT Basically the same. In the P-well of the gate region and the N+ source region, the IGBT has almost no difference from the MOSFET. The top N+ was the S pole or the emitter, and the bottom P+ was the D pole or the collector. If used during doping In the reverse order, then the P-channel IGBT. IGBT is fabricated because of the structure of the NPNP, so there will be a parasitic thyristor. It is generally not desirable to turn on the thyristor.
 
 
 
 IGBT
 
 
 
Figure 1 Typical N-channel IGBT structure
 
Some IGBTs are manufactured without the N+ buffer layer, which is called a non-through-type (NPT) IGBT. The opposite has a buffer layer called a through-type (PT) IGBT. If doped with this layer thickness Properly designed, this layer can greatly improve the performance of the entire device. Although the IGBT is similar to the MOSFET in the shape, the IGBT is more similar to BJT in practical work. This is because the drain layer (injection layer) of P+ can minority carriers. The conduction modulation characteristics caused by the injection of the N-drift region. 
 
Figure 2 IGBT equivalent circuit
 
From the above analysis, the equivalent circuit diagram of the IGBT can be drawn (Fig. 2). The equivalent circuit includes MOSFET, JFET, NPN and PNP transistors. The collector of PNP is connected to the base of NPN. The collector of NPN passes through the base of JFET and PNP. The poles are connected. NPN and PNP represent parasitic thyristors. This thyristor will bring a regenerative feedback loop. RB is the NPN BE junction resistor, which is to ensure that the parasitic thyristor is not locked to ensure the IGBT. Not locked. The JFET represents the contraction current between any two adjacent IGBTs. The JFET is present in most voltage ranges, leaving the MOSFET at a low voltage resulting in a low RDS(on) value. Figure 3 shows the IGBT. Circuit symbol. The three poles are called collector (C), gate (G) and emitter (E).
  
Figure 3 IGBT circuit symbol
 
IXYS products include both NPT and PT type IGBTs. The two types of physical structures are shown in Figure 4. As mentioned earlier, the PT type has an additional layer. This has two main functions: (i) avoid because of The depletion region is extended by the high voltage, thereby avoiding the punch-through type failure. (ii) Since the hole portion injected in the P+ collector region is recombined at this layer, the residual current at the turn-off is reduced, thereby shortening the off Breakdown time. NPT type IGBTs have the same forward and reverse breakdown voltages and are suitable for AC applications. PT type IGBTs have a reverse breakdown voltage lower than the forward breakdown voltage and are suitable for DC circuits ( Because the device in the DC circuit does not need to reverse the voltage).
 
 IGBT
 
 
 
Figure 4 NPT and PT type IGBT structure
 
Table 1: Comparison of IGBT characteristics between NPT and PT
 
 
Operating mode
Positive turn-off and conduction mode
 
As shown in Figure 1, when the collector-emitter plus forward voltage and the gate and emitter are shorted, the IGBT enters the positive shutdown mode. At this point, J1 and J3 are forward biased and J2 is reverse biased. The depletion region at both ends of J2 partially diffuses to the P base and N drift regions.
 
When the short circuit between the gate and the emitter is removed, and a sufficient voltage is applied to the gate to reverse the silicon in the P base region, the IGBT is transferred from the forward turn-off mode to the forward conduction mode. In the mode, a conduction channel is formed between the N+ emitter and the N-drift region. The electrons of the N+ emitter flow to the N-drift region through the channel. The electrons flowing to the N-drift region reduce the potential of the N-drift region. The junction of the P+ collector/N-drift region is forward biased so that high-density minority carrier holes are injected from the P+ collector into the N-drift region. When the injected carrier density is much higher than the background density In the case of the N-drift region, a condition called hole ion current is established. This hole ion current attracts electrons from the emitter to the emitter to maintain local charge neutralization. Thus, the N-drift region is established. The concentration of certain holes and electrons is concentrated. This type of partitioning greatly improves the conductivity of the N-drift region. This mechanism is called the conduction modulation of the N-drift region.
 
Reverse shutdown mode
 
When a negative voltage is applied between the collector and the emitter as shown in Figure 1, J1 is reverse biased, and its depletion region is diffused to the N-drift region. The breakdown voltage for reverse turn-off is made by P+ collector/N. - The open base BJT formed by the drift region / P base is determined. If the N-drift region is insufficiently doped, the device will be easily broken down. To obtain the required breakdown voltage, the N-drift region must be controlled. Resistance and thickness.
 
To obtain specific parameters for reverse breakdown voltage and forward voltage drop, the following is the formula for calculating the width of the N-drift region:
 
 
among them:
 
LP: minority carrier spur length
 
Vm: maximum shutdown voltage
 
Εo: dielectric constant of free region
 
Εs: dielectric constant of silicon
 
q: charge
 
ND: Doping density of the N drift region
 
Note: Reverse turn-off of IGBTs is rare in most applications, but the use of anti-parallel diodes (FRED) is common.
 
Output characteristics
Figure 5 shows the forward output characteristic of an NPT-IGBT. This is a group of curves, each representing a different gate-emitter voltage. The collector current (IC) is a function of VCE when VGE is fixed. .
 
 IGBT
 
 
Figure 5 I-V output curve of NPT-IGBT
 
Note that the offset voltage is 0.7V. This is because there is an additional PN junction for the IGBT of the P+ collector. This PN junction distinguishes the characteristics of the IGBT from the MOSFET.
 
Transmission characteristics
The transmission characteristics refer to the response function of ICE to VGE changes at different temperatures, such as 25 degrees, 125 degrees, and -40 degrees. As shown in Figure 6, the gradient of the transmission characteristics at a given temperature is called the device. Transconductance (gfs) at temperature.
 
 IGBT
 
Figure 6 IGBT transmission characteristics
 
Generally speaking, it is necessary to obtain a high current capability at a lower gate voltage. It is desirable that the value of gfs is relatively large. The structure of the channel and the gate determines the value of gfs. Both gfs and RDS(on) are controlled by the length of the channel, and The length of the channel is determined by the difference between the diffusion depth of the P-base and the N+ emitter. The tangent on the transmission characteristic determines the threshold/threshold voltage (VGE(th)) of the device.
 IGBT
 
Figure 7 Transconductance characteristics of an IGBT
 
Figure 7 shows the transconductance characteristics (IC-gfs) of an IGBT. As the collector current increases, gfs increases, but as the collector current continues to increase, the growth curve of gfs slowly and slowly. This is because of parasitic MOSFETs. The saturation phenomenon slows down the increase of the driving current of the base of the PNP transistor.
 
Switching characteristics
The switching characteristics of the IGBT are very similar to those of the MOSFET. The main difference is that since the N-drift region stores charge, it will cause a residual collector current. This residual current increases the turn-off loss and requires two devices in the half-bridge circuit. The dead time between breaks increases accordingly. Figure 8 shows the test circuit for switching characteristics. Figure 9 shows the corresponding voltage and current waveforms for turn-on and turn-off. IXYS IGBT products use a gate voltage of 15V to 0V during testing. In order to reduce the switching loss, it is recommended to add a negative voltage (such as -15V) to the gate when it is turned off.
 
 
 
Figure 8 switch characteristic test circuit
 
The switching speed of the IGBT is limited by the lifetime of minority carriers in the N-drift region of the base of the parasitic PNP transistor. This region is inoperable externally, so there is no external means to increase the rate at which this charge is removed. To increase the switching speed. The only way to remove this charge is to re-neutralize inside the IGBT. In addition, adding N+ buffer to collect minority carrier charge can increase the neutralization speed of this charge.
 
 
Figure 9 IGBT turn-off voltage and current waveform
 
Eon represents the conduction energy, which is the integral of IC*VCE in the VCE range from 10% ICE to 90%. The amount of conduction energy depends on the reverse recovery characteristics of the freewheeling diode, so if the IGBT contains a freewheeling diode Be sure to pay special attention.
 
Eoff represents the turn-off energy, which is the integral of IC*VCE in the 10% VCE to 90% IC interval. Eoff is the main component of the IGBT switching loss.
 
Lock/up (Latch-up)
In the on state, the internal current of the IGBT is as shown in Fig. 10. The holes injected into the N-drift region from the P+ collector form two current paths. A part of the holes disappear due to electron neutralization with the MOSFET channel. Part of the hole is attracted to the vicinity of the reverse layer by the negative charge of the electron. From the epitaxy through the P layer, a voltage drop is formed in the body ohmic resistance region. If this voltage is large enough, the N+P junction will be forward biased. At the same time, a large amount of electrons are injected from the emitter and the parasitic NPN transistor will be turned on. If this phenomenon occurs, the parasitic NPN and PNP transistors will be turned on at the same time, so the thyristor composed of the two tubes will be latched up. Thus, the entire IGBT is locked. Once the lock occurs, the gate voltage will lose control of the current of the collector. The only way to turn off the IGBT is to force the commutation, just like in a real thyristor. .
 

 
Figure 10 Current flow in the IGBT on state
 
If this locked state cannot be terminated quickly, the IGBT will be burnt due to excessive power dissipation. The maximum peak current that the IGBT can pass without locking is called (ICM). The device data sheet will indicate This parameter. Exceeding this current value, a sufficiently large peripheral voltage drop activates the thyristor and causes locking.
 
Safe Operating Area (SOA)
The so-called safe working area refers to a range of current-voltage, in which the device can work safely without being damaged. For IGBT, this interval consists of the largest collector-emitter voltage VCE and collector current. Ic defines that the IGBT can safely operate without damage in this interval. The safe working area of ​​the IGBT has the following types: forward biased safe working area (FBSOA), reverse biased safe working area (RBSOA) and short circuit safe working area. (SCSOA).
 
Forward Biased Safe Work Area (FBSOA)
For inductive load applications, FBSOA is an important feature. It is determined by the maximum collector-emitter voltage and saturated collector current. In this mode, electrons and holes move through the drift region and remain relatively high. The collector voltage. The relationship between the density of electrons and holes in the drift region and the current current density is:
 
Where Vsat,n and Vsat,p are the saturation drift speeds of electrons and holes, respectively. The net positive charge of the drift region is:
 
This charge determines the electric field distribution in the drift region. Under steady-state positive shutdown conditions, the charge in the drift region is equal to ND. In the positive safe operating range, the net charge is much larger than ND because of the density of holes. Far greater than the density of the electron flow.
 
Reverse Bias Safe Work Area (RBSOA)
For turn-off transient analysis, RBSOA is an important state. The current that can be turned off is limited to twice the rated current of the IGBT. For example, an IGBT with a rated current of 1200A can turn off the maximum current is 2400A. The maximum current is The peak voltage of the collector and emitter when turned off. The peak value of VCE is equal to the product of DC voltage and LбdIC/dt. Lσ is the stray inductance of the power circuit. The relationship between the maximum current IC and VCE under RBSOA is shown in Figure 11. .
 
Figure 11 Reverse safety working area of ​​IGBT
 
In this mode, the bias of the gate is 0 or a negative voltage, so that the current in the drift region is only through the holes (N-channel IGBT). The holes increase the charge in the drift region, so the P-base/N drift The electric field of the node is increased. The net charge of the empty charge region under this condition is:
 
Where Jc is the total collector current. The avalanche voltage of RBSOA is:
 
Short Circuit Safe Work Area (SCSOA)
For devices operating in motor control applications, a key requirement is to be able to safely turn off when the load is shorted. When the current is overloaded, the current of the collector rises rapidly until the device can withstand the limits. The device can not be damaged under such conditions. It is possible to limit the current amplitude to a safe level before the control circuit detects the short-circuit condition and turns off the device.
 
The collector current IC of the IGBT is a function of the gate-emitter voltage VGE and the temperature T. The transmission characteristics shown in Figure 6 indicate the maximum IC value for a given VGE. For a VGE of 15V, the value is limited to 80A, approximately It is 1.5 times the rated value. Considering that the short-circuit current is often 6-7 times of the rated current, this value is very small.
 
Figure 12 SCSOA test circuit
 
Figure 12 shows a test circuit for SCSOA. The short-circuit inductor value determines the operating mode of the circuit. When this value is uH, the circuit operates in a similar manner to the normal inductive load switch. When the IGBT is turned on, VCE drops to the saturation voltage. The rate of dIC/dt increases and the IGBT gradually saturates. When the collector current is higher than 2 times the rated current, the shutdown operation is not allowed because it is beyond the RBSOA. If the short circuit occurs, it must wait for the device to reach the active working area. Turn off the IGBT within 10us to prevent the device from being damaged due to overheating.

IGBT Module Application: Fruit Labeling Machine

Source: https://www.slw-ele.com/igbt-knowledge-3.html

IGBT KNOWLEDGE 2

IGBT KNOWLEDGE 2

As one of the important high-power mainstream devices for power electronics, IGBT has been widely used in household appliances, transportation, power engineering, renewable energy and smart grid. In industrial applications such as traffic control, power conversion, industrial motors, uninterruptible power supplies, wind and solar equipment, and frequency converters for automatic control.
 
The IGBT module is a modular semiconductor product that is packaged by IGBT and FWD through a specific circuit bridge; the packaged IGBT module is directly applied to equipment such as inverter and UPS uninterruptible power supply; IGBT module has energy saving, convenient installation and maintenance, and heat dissipation. Stable and so on; the current market sales are mostly such modular products, generally referred to as IGBT modules; with the promotion of energy conservation and environmental protection concepts, such products will become more and more common in the market.

IGBT
 
How IGBT works
 
IGBTs are a natural evolution of vertical power MOSFETs for high current, high voltage applications and fast end devices. Since a high breakdown voltage BVDSS requires a source-drain path, and this channel has a high resistivity, resulting in a power MOSFET having a high RDS(on) value, the IGBT eliminates these existing power MOSFETs. The main drawback. Although the latest generation of power MOSFET devices have greatly improved the RDS(on) characteristics, at high levels, the power conduction losses are still much higher than the IGBT technology. The lower voltage drop, the ability to convert to a low VCE(sat), and the IGBT structure support higher current densities and simplify the schematic of the IGBT driver compared to a standard bipolar device.
 
The structure of the IGBT silicon is very similar to that of the power MOSFET. The main difference is that the IGBT adds a P+ substrate and an N+ buffer layer (NPT-non-punch-IGBT technology does not add this part). One of the MOSFETs drives two bipolar devices. The application of the substrate creates a J1 junction between the P+ and N+ regions of the tube. When the positive gate bias causes the P-base region to be inverted below the gate, an N-channel is formed, a current flow occurs simultaneously, and a current is generated in exactly the manner of the power MOSFET.
 
IGBT and MOSFET are different
 
MOSFET full name power field effect transistor. Its three poles are source (S), drain (D) and gate (G). The main advantages are good thermal stability and large safe working area. The disadvantages are low breakdown voltage and low operating current.
 
The IGBT is a combination of a MOSFET and a GTR (power transistor). Its three poles are collector (C), emitter (E) and gate (G). The breakdown voltage can reach 1200V, and the maximum saturation current of the collector has exceeded 1500A. The inverter with IGBT as the inverter device has a capacity of more than 250kVA and an operating frequency of up to 20kHz.

IGBT
 
IGBT and MOSFET association
 
In the early 1980s, DMOS (double diffusion formed metal-oxide-semiconductor) processes for power MOSFET fabrication technology were introduced into IGBTs. At that time, the structure of the silicon chip was a thicker NPT (non-punch through) design. Later, a significant improvement in parametric tradeoffs was achieved by using a PT (punch-through) type of structure, which is a technological advancement over epitaxial wafers and the use of n+ buffer layers designed for a given blocking voltage. Progressive. In the past few years, the DMOS planar gate structure fabricated on epitaxial wafers using PT design has been designed from 5 micron to 3 micron.
 
In the mid-1990s, the trench gate structure returned to a new concept of IGBT, a new etch process using silicon dry etch technology borrowed from large-scale integration (LSI) processes, but still punch-through ( PT) type chip structure. In this trench structure, a more significant improvement in the trade-off between on-state voltage and off-time is achieved. The critical structure of the silicon chip has also undergone a dramatic transformation, first using a non-punch-through (NPT) structure, which in turn changes to a weak through-pass (LPT) structure, which results in a similar improvement in the safe working area (SOA) with the evolution of the surface gate structure. .
 
development trend
 
1, low power IGBT
 
IGBT application range is generally in the range of 600V, 1KA, 1KHz or above. In order to meet the development needs of the home appliance industry, Motorola, ST Semiconductor, Mitsubishi and other companies have introduced low-power IGBT products, which are used in microwave ovens, washing machines, induction cookers, and electronic rectifiers for the home appliance industry. Applications such as cameras and cameras.
 
2, U-IGBT
 
U (trench structure) - The IGBT is grooved on the die, and a trench gate is formed inside the chip cell. By adopting the channel structure, the cell size can be further reduced, the channel resistance can be reduced, the current density can be improved, and the product with the same rated current and the smallest chip size can be manufactured. A number of existing companies produce a variety of U-IGBT products for low voltage drive and surface mount requirements.
 
3, NPT-IGBT
 
NPT (non-punch-through type)--IGBT adopts thin silicon wafer technology, and replaces high-complexity and high-cost thick-layer high-resistance epitaxy with ion injection into the emitter area, which can reduce the production cost by about 25%. The higher the withstand voltage, the greater the difference in cost. It has more characteristics in performance, high speed, low loss, positive temperature coefficient and no locking effect. When designing 600-1200V IGBT, NPT-IGBT has the highest reliability. Siemens can provide 600V, 1200V, 1700V series products and 6500V high voltage IGBTs, and introduce low saturation voltage drop DLC type NPT-IGBT. Ixus, Harris, Intersil, Toshiba and other companies have also developed NPT- IGBT and its module series, Fuji Electric, Motorola, etc. are under development, NPT type is becoming the development direction of IGBT.
 
4, SDB--IGBT
 
In view of the current manufacturers attach great importance to the development of IGBTs, Samsung, and other companies use SDB (Silicon Direct Bonding) technology to produce fourth-generation high-speed IGBT and module products on IC production lines, featuring high speed and low saturation voltage drop. Low tail current, positive temperature coefficient is easy to connect in parallel, excellent performance in 600V and 1200V voltage range, divided into UF, RUF two systems.
 
5, ultra fast IGBT
 
International Rectifier IR's research and development focus is to reduce the tailing effect of IGBT, so that it can be quickly turned off. The ultra-fast IGBT developed can minimize the tailing effect, the turn-off time does not exceed 2000ns, and the special high-energy illumination layering technology is adopted. The off time can be below 100ns, and the tailing is shorter. The key products are designed for motor control. There are 6 models available, and they can be used in high power converters.
 
6, IGBT / FRD
 
Based on IGBT, IR has introduced two new devices combining FRD (fast recovery diode). IGBT/FRD is effectively combined to reduce the loss of conversion state by 20%. It is packaged in TO-247 package with rated specifications of 1200V and 25. 50, 75, 100A, for motor drive and power conversion, new technology based on IGBT and FRD facilitates parallel connection of devices, achieves more uniform temperature in multi-chip modules, and improves overall reliability.

IGBT
 
7, IGBT power module
 
IGBT power modules use IC drive, various drive protection circuits, high-performance IGBT chips, new packaging technology, from composite power module PIM to intelligent power module IPM, power electronic building blocks PEBB, power module IPEM. PIM develops to high voltage and high current, and its product level is 1200-1800A/1800-3300V. In addition to IPM for frequency control, the IPM of 600A/2000V has been used for VVVF inverters of electric locomotives. The planar low-inductance package technology is a PEBB with a high-current IGBT module as an active device for missile launchers on ships. IPEM uses PE-chip multi-chip module technology to assemble PEBB, which greatly reduces the circuit wiring inductance and improves system efficiency. The second-generation IPEM has been successfully developed, in which all passive components are buried in the substrate in a buried manner. Intelligent and modularization has become a hot spot for IGBT development.