The new inductor core meets the industry’s needs for smaller, quieter, and more reliable power supplies

“Engineering composite magnetic cores allow Inductor manufacturers to integrate large inductors into small volumes. FlakeComposite’s new technology brings the core performance to a new level, and adds additional mechanical flexibility to support new ultra-thin devices.

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Author: Patrik Kalbermatten, KEMET

Engineering composite magnetic cores allow inductor manufacturers to integrate large inductors into small volumes. FlakeComposite’s new technology brings the core performance to a new level, and adds additional mechanical flexibility to support new ultra-thin devices.

Power inductors are key devices used to manage energy flow in switching converters, ensuring smooth power transmission and helping coordinate commutation. In order to keep the current flowing for long enough to make the circuit work correctly when the main switch is turned off, engineers need to choose a suitable inductance value to store enough energy.

Although in order to support continuous or discontinuous current mode (CCM or CDM) or resonant operation, the calculation of the inductance value will vary according to the type of converter, but for a given rated current, the inductance value is usually larger than the size . In addition, it is necessary to provide stable performance in the expected frequency range, and for applications such as automotive or aerospace, it is also necessary to provide temperature stability and increase the maximum operating temperature.

Engineering inductor reaches its limit

The properties of inductors are limited by the laws of physics. Careful design of the core material helps push these limits to the limit, thus providing the best combination of parameters for the engineer’s application. Commonly used magnetic core materials include manganese zinc (MnZn) and nickel zinc (NiZn) ferrites, as well as metal powder cores formed by specially formulated alloy particles (separated by insulating binders). Although it is difficult to solve power applications by increasing the magnetic core volume, thin-film inductors can also be manufactured by depositing cobalt-based alloys to achieve high permeability with good saturation performance.

Despite some shortcomings, ferrite cores have high permeability-NiZn materials are as high as about 300, while MnZn is even higher. These materials are often very brittle, so they are not suitable for embedding in PCBs or making thin inductors, such as planar lateral flux devices. In addition, they will experience sudden saturation, causing the inductance to roll off sharply as the DC bias increases.

As far as powder cores are concerned, popular alloys include iron silicon (FeSi) or sendust (FeSiAl), as well as other compositions including amorphous iron and permalloy. This type of distributed air gap magnetic core has a granular structure and its saturation characteristics are softer than ferrite inductors, so it is less sensitive to small offset DC bias. On the other hand, its magnetic permeability is usually about an order of magnitude smaller than that of ferrite, and its organic binder cannot withstand high operating temperatures.

The new sheet metal pressing technology can now produce distributed air gap magnetic core materials with permeability comparable to NiZn ferrite and soft saturation characteristics comparable to traditional powder cores. In addition, this new FlakeComposite core also has higher temperature stability, higher maximum operating temperature and mechanical flexibility. This increased flexibility brings not only the opportunity to create ultra-thin inductors, but also the ability to embed powerful inductors in the PCB to save space, and to explore opportunities to integrate new types of inductors (such as transverse flux inductors). ) Integrated with active devices in the next generation power conversion design.

Performance comparison

Figure 1 shows the comparison of the key permeability and saturation characteristics of FlakeComposite core materials and ferrite, powder and thin film cores.

Figure 1: FlakeComposite’s permeability is equivalent to ferrite, and has excellent saturation performance.

As we all know, ferrite materials will lose permeability at high frequency, high temperature or high DC bias current value, resulting in a rapid decrease in inductance value, thereby affecting performance. To ensure that FlakeComposite core inductors are at least as good as ferrite inductors, we need to compare frequency, temperature, and DC bias performance.

Figure 2 compares the dispersion of FlakeComposite and NiZn ferrite composite permeability. The graphs of the two materials show that the permeability decreases rapidly above about 6MHz, which indicates that FlakeComposite has the same or better performance as NiZn in switching converters with operating frequencies up to 1MHz.

Figure 2: For power applications with frequencies up to several MHz, FlakeComposite provides performance comparable to NiZn ferrite.

Comparing the magnetic saturation characteristics, FlakeComposite is softer than NiZn ferrite when it enters saturation, and has a lower temperature dependence, so it is of great benefit (Figure 3).

Figure 3: Compared with NiZn ferrite, FlakeComposite’s magnetic saturation curve is softer and has lower temperature dependence.

Figure 4 compares the DC bias performance of FlakeComposite with NiZn ferrite and traditional metal composite (powder). FlakeComposite combines the advantages of both types. It has excellent permeability comparable to NiZn under low bias, while maintaining higher permeability under high bias with the lowest temperature dependence.

Figure 4: When a high DC bias electric field is applied, the DC bias characteristics show that FlakeComposite has a higher magnetic permeability.

If the operating temperature of the inductor reaches the Curie temperature of the magnetic core material-at which temperature the magnetic core will lose its magnetism-the magnetic permeability of the magnetic core will drop rapidly, resulting in a rapid loss of inductance. As shown in Figure 5, the Curie temperature of FlakeComposite is also higher than that of typical NiZn or MnZn ferrites.

Figure 5: FlakeComposite has a higher Curie temperature, which ensures that the inductance value is maintained at a higher operating temperature.

The inductor becomes thinner and the footprint becomes smaller

In order to continuously reduce the footprint of power conversion modules such as point-of-load (PoL) converters, the industry has proposed new designs that integrate active and passive components. Unlike the traditional longitudinal flux mode previously used to construct thin inductors, the planar inductors used in these designs have been specifically designed to have a lateral flux mode. As the thickness of the inductor decreases, the transverse flux inductor exhibits increasingly superior inductance compared with the traditional longitudinal flux device. FlakeComposite’s mechanical properties can realize inductors with a thickness of 50μm to 2mm, so it is very suitable for manufacturing ultra-thin transverse flux inductors.

Inductors made of FlakeComposite are extremely thin but sturdy. In order to help save footprint, they can also achieve inherent alignment when embedded in PCBs, and can reduce inductance by up to 40% compared with traditional ferrite cores.器高。 Height.

Elastic high permeability material

In addition to being used in power inductors, FlakeComposite’s combination of magnetic and mechanical properties is also suitable for electromagnetic shielding applications including EMI suppression and shielding wireless transmission coils, thereby optimizing charging performance and protecting nearby Electronic devices. FlakeComposite technology is the core of Kemet’s Flex Suppressor® products, and it has been proven that such products can reduce electromagnetic noise in various applications.

Summarize

The new method of FlakeComposite can optimize the magnetic core performance of inductors and further expand the opportunities to realize the miniaturization of power conversion circuits in the future. Therefore, it will surpass the achievements of current ferrite core materials. FlakeComposite can provide similar permeability, as well as excellent saturation characteristics, DC bias performance and higher temperature performance, thereby realizing the design of ultra-thin power inductors and providing the required mechanical performance for PCB embedded inductors, thereby Realize real space saving.

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How to Optimize Building and Home Automation Design for Energy Efficiency

“Energy efficiency is one of the most important design considerations when developing building automation products. Some of the new wireless smart sensors can work for more than five years on a single coin cell battery, and some even last 10 years or more. In this white paper, I will discuss various advances in energy efficiency in building automation.

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Energy efficiency is one of the most important design considerations when developing building automation products. Some of the new wireless smart sensors can work for more than five years on a single coin cell battery, and some even last 10 years or more. In this white paper, I will discuss various advances in energy efficiency in building automation. Let’s start by taking a look at how nanowatt-class integrated circuits (ICs) can enhance functionality and reduce power consumption, and how recent advancements have enabled low power consumption and long operating life. The average current consumption of a nanowatt device can be measured in nanoamps (nA) (one billionth of an amp). A standard CR2032 coin cell battery used in long-range wireless smart building sensors can provide approximately 2,100nA over 10 years.

For nanowatt-class modules introduced to the mass market in the past two years, the current required is less than half that of the previous generation. Because designers need to design with less space for batteries and power supplies, they are able to build smaller products. In addition, the convenience and safety of retrofitting existing residential, commercial and industrial areas with sensors and smart devices has also increased. Because these devices can operate for years on commercial-grade batteries, there is no need to use wires or to program routine maintenance for battery replacement. With the rapid spread of IoT-related applications in building automation, attention has been paid to the huge potential of using embedded sensors to improve safety and efficiency: these sensors can not only detect individual component failures in very large systems, but also monitor through mmWave radar. Human health and comfort.

Energy Efficiency in Building Automation: Considerations, Importance and Future Trends

When it comes to energy efficiency, design engineers need to consider many factors. They must balance performance between functionality, battery life expectancy, and the average current draw of each device on the board, as well as create an accurate steady-state consumption model for the design. In order to reduce power consumption as much as possible, many engineers implement some functions very cleverly in the design, which improves the overall efficiency.

It is not only battery-powered devices that need to be considered for energy efficiency; almost all line-powered systems do. For example, in the heating, ventilation and air conditioning (HVAC) industry, the US Department of Energy (DOE) has instituted stricter regulations to minimize efficiency ratings (called “seasonal energy efficiency ratios”). These regulations in turn have led to the rapid replacement of permanently split capacitor motors by electronically commutated motors, which are now standard on most manufacturers’ next-generation HVAC equipment. Figure 1 compares the two motors described above. DOE believes that while consumers bear the initial cost of the more expensive motors described above, electronically commutated motors actually deliver significant energy efficiency improvements, so the technology pays off quickly – saving more than $9 billion in American households by 2030 electricity costs. For high-efficiency electronically commutated motor designs, it is recommended to first refer to the TI Electronically Commutated Motor Reference Design for HVAC Fans with Low-Cost BOM. The following sections detail the current battery-powered applications in building automation – building safety, ultra-low-power product design, and energy efficiency. There are many examples of this trend. As shown in Figure 2 on the following page, the security and video surveillance market is expected to grow by around 5% from 2013 to 2023 (Source – Omdia, “Industrial semiconductor Market Tracker”, 2020*). This growth will inevitably drive stakeholders to continuously optimize the efficiency of security and video surveillance equipment.

In larger spaces and older buildings, replacing intermittent line power with battery-powered sensors can be significantly more cost-effective. Battery life has been extended for energy efficiency, so remote sensors in a building or residence can deliver real-time environmental data and sensor conditions for longer than ever before without using line power. Energy-Efficient Devices Can Solve Engineering Challenges In building security applications, Hall-effect sensors can detect changes in magnetic fields using low-cost magnets placed on doors and windows. As with the DRV5055 angle evaluation module, two DRV5055 sensors can be used in combination to achieve 2D position detection.With this advanced induction method, as well as the calibration method used and the number of calibration points, it is possible to

Figure 4 on the next page shows another low-power, energy-efficient application that uses a 320nA TLV8802 op amp as the signal chain for a passive infrared sensor. The TLV8802 is ideal for cost-sensitive systems using battery-operated devices. PIR applications require an amplified and filtered signal at the output of the PIR sensor so that the amplitude of the signal entering the subsequent stages of the signal chain is large enough to provide useful information. When a PIR sensor detects the movement of a distant object, the typical signal level at its output is in the microvolt range, so amplification is required. Filtering is required to limit the noise bandwidth of the system before the noise reaches the input of the window comparator. The filtering function also sets the minimum and maximum speed limits for the system to detect movement.

Another way to optimize a design for energy efficiency is to use a combination of nanowatt timers and load switches to power down more power-hungry devices and even microcontrollers (MCUs) and put them into a deeper sleep state. Figure 5 is a schematic of a simple low-power wireless environmental sensor suitable for residential and commercial environments. In Figure 5, the TPL5111 is used as a periodic wake-up or enable signal for the TPS22860, which powers the HDC2080 when the TPS22860 is enabled. This circuit also has a DONE pin that connects to the SimpleLink™ MCU’s general-purpose input/output pins to power down the HDC2080 after processing is complete. When the nanowatt timer turns off the load switch, it cuts off the power from the HDC2080, which greatly reduces power consumption. A wide time range can be set for the TPL5111, which can save more power when the polling frequency is set to a high latency value. Energy Harvesting for Building Automation Many of the current ultra-low power innovations are based on coin cell battery designs that have been around for decades, but these components consume electrical energy converted from light (photovoltaic), mobile or radio frequency energy. Energy harvesting can provide additional power to the device, thereby greatly improving energy efficiency. When combined with ultra-low-power devices and energy-efficient designs, the useful life of remote building sensors can be extended by years. Supercapacitors, when used in conjunction with or in place of coin cells in low-power devices, can store harvested energy for use by the device. Unlike disposable batteries, supercapacitors charge quickly.

Energy Harvesting Applications: Door Handles

Extra energy is easily collected by turning the door handle for use by the smart lock. When used in conjunction with a motor, the motor shaft can be integrated with a reduction gear to convert the slow rotation of the door handle into a higher-speed rotation of the motor, allowing the motor to generate electricity, which is then rectified and conditioned for storage within a supercapacitor. Figure 6 shows a possible setup to test this energy harvesting method by using a grip dynamometer and coupler on the door handle.

Figure 7 shows the complete power path for converting the rotational motion of the door handle into stored energy. This power path has two load switches to reduce battery load when the energy on the supercapacitor is high enough to power the system or provide energy for battery charging. The DRV8847 dual H-bridge motor driver can harvest energy from the generator. Figure 8 shows the output power of this power architecture.

There are many other TI products and designs that address the industrial needs of energy harvesting, such as the Wireless Switching Power Supply Energy Harvesting Reference Design, which utilizes a zero-frequency energy harvesting switch to generate energy at the push of a button. Another good example is the Energy Harvesting Ambient Light and Environmental Sensor Node Reference Design for Sub-1GHz Networks, which uses two integrated solar cells to provide additional power to the system by harvesting photovoltaic energy. Figure 9 shows the output of this energy harvesting door handle along with the active rectification of the motor output.

An example of an energy efficient design

A central component of smart home design is the smart lock, which wirelessly receives commands from authorized users, monitors hallways, and operates door locks without human intervention. But if battery life and maintenance often interfere with the normal operation of the smart lock, the smart lock will not be recognized by the mainstream standard lock/key mechanism. Energy-efficient design and energy harvesting help extend the life of Electronic smart locks by years. Consider an advanced smart lock that ensures the deadbolt is in the door frame and the door is fully closed. When a user unlocks the latch turnstile from the inside, a small amount of energy is generated, which can be harvested and used to verify the latch position when the door is locked remotely. Obviously, this is only one of the proposed methods, there can be many others. Figure 10 on the next page shows a block diagram of this particular approach.

There is a simple insert on the side of the door frame that can be installed on the back of the bolt plate. Inside these contacts there is a special resistance value that provides a voltage drop across the contacts. An op amp can be used to compare this voltage, or an ultra-low power analog-to-digital converter can be used to measure the output voltage to further improve accuracy or prevent tampering. After the MCU verifies the output value, it cuts power to the load through the load switch to minimize power consumption (≤2nA in shutdown mode). Due to the passive nature of the peripherals, this design is highly efficient and can provide additional intrusion and tamper-proof security features for smart locks at very low additional cost. Figure 11 outlines the latch position sensing application in more detail.

in conclusion

For a new technology to replace a mature but low-tech incumbent technology, it usually needs to have clear advantages and not impose any serious burden. The implementation of ultra-low power consumption not only improves convenience, but also provides advanced technology that requires little maintenance to successfully solve these challenges. With years of reliable data insights and computing power you can rely on, ultra-low-power technologies are redefining expectations for where, how, and how long smart devices can be deployed. The ripple effect of these innovations will continue long after the first-generation batteries are finally obsolete.

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Nearly 30% of Huawei’s 5G base station equipment comes from the United States. Who controls its fate?

As one of Huawei’s most important businesses, Huawei’s base station equipment still relies heavily on chips and components from American manufacturers. The latest teardown found that parts from US suppliers accounted for nearly 30% of the total cost of Huawei’s core 5G base station units by value. In addition, the main semiconductor devices in the equipment are all foundry by TSMC.

The Huawei baseband unit dismantled by the Japanese fomalhaut dismantling laboratory measures 48 cm x 9 cm x 34 cm and weighs about 10 kg. The motherboard shows that “Hi1382 TAIWAN” is printed on the main chip of Huawei’s 5G baseband unit circuit board. This is a chip designed by Huawei HiSilicon, and “TAIWAN” means that the chip is manufactured by TSMC.

According to the dismantling results, the production cost is estimated to be about 1320 US dollars. Among them, the main chip is designed by HiSilicon, and the cost is about 42 US dollars. The memory chip (Memory) comes from Samsung in South Korea, and the cost is about 3.2 US dollars. Cypress and Winbond Electronics in Taiwan, China, cost about $0.3, FPGA from Lattice and Xilinx in the United States, cost about $60, power management chips from U.S. TI and ON Semiconductor, cost $0.1~0.6, – The circuit protection device is from Japan TDK, and the cost is about 0.15 US dollars.

Overall, components made in China accounted for 48.2%, higher than the domestic chip share (41.8%) in Huawei’s top 5G smartphone Mate 30. The HiSilicon processor accounts for most of the cost of domestic chips. The main chip manufactured by TSMC is used for some key computing tasks. Since HiSilicon uses American technology and software in the design and manufacturing process, in The chip may not be available under the ban. In addition, the proportion of domestic chips is less than 10%.

“While key parts are provided by Chinese manufacturers, they make up less than 1 percent of the part count,” said a Fomalhaut executive. So the device remains “largely dependent on U.S.-made Components”. South Korea’s Samsung provides the second largest share of the cost of memory chips after U.S.-made components. While the parts made in Japan are not prominent, only a few Japanese suppliers such as TDK, Seiko Epson and Nichicon are found.

The third U.S. ban on Huawei, the most severe, took effect on September 15, and any unlicensed U.S. technology cannot be supplied to Huawei. As Huawei’s most important foundry partner, TSMC announced in July that it would stop shipping to Huawei after the ban took effect. Huawei’s other foundry supplier, SMIC, also said a few days ago that it “has submitted an application for an export license covering several Huawei products” and reiterated that it has always adhered to compliant operations and abides by the relevant laws and regulations of the place where it operates.

On the other hand, MediaTek, the world’s second-largest mobile chip maker after Qualcomm, also confirmed that it has applied for a license to the United States to resume some business with Huawei. It is unclear whether the Commerce Department will approve the request.

So while Huawei is working hard to wean itself off its reliance on overseas suppliers, the immediate problem is inventory.

In the global communications market, Huawei has established itself in the 3G and 4G markets, becoming the world’s leading supplier of telecom infrastructure equipment, and has gained nearly 30% of the global mobile base station equipment market, surpassing Finland’s Nokia and Sweden’s Ericsson.

By offering extremely cost-competitive products at 40 percent lower prices than competitors, Huawei has beaten the other two vendors. In addition to the Chinese market, Huawei has established a solid presence in Africa and other regions. However, U.S. sanctions could be devastating to Huawei’s base station business as well as its smartphone business. A Huawei supplier said the company had been buying a lot of parts since the spring, but had not presented any production plans since Sept. 15.

Huawei has been stockpiling key parts from the U.S. and other suppliers for its base station and smartphone business since Meng was arrested in Canada in late 2018, according to previous reports. To secure some of the most important supplies, Huawei has built up chip inventories for its vital telecom equipment business, while also preparing a stockpile of up to two years for key U.S. chips such as Intel’s server CPUs and Xilinx’s FPGAs, among others. .

The reduced availability of Huawei’s products in the market due to the ban could also reduce its competitiveness. On the other hand, due to the weakening of Huawei’s competitiveness, it may also be difficult for users to obtain high-quality and affordable equipment to some extent, which will affect the plans of many countries to build 5G networks.

　

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Industry | Escort the terminal security of the entire network, 360 EDR helps improve digital security capabilities

With the steady advancement of digital transformation, all walks of life are facing more severe security challenges while enjoying the dividends of digital transformation. Cyber ​​threats have gradually evolved from simple individual performances to organized cyber crimes and advanced cyber attacks supported by intelligence. Traditional “passive” and “single” defense products have been exhausted.

Recently, the government and enterprise security group under 360 (601360.SH, hereinafter referred to as “360”), relying on the leading security capabilities of 360 security brain in security big data, artificial intelligence analysis, attack source tracing, etc., launched 360 new generation terminal detection Response System (hereinafter referred to as “360 EDR”). Based on the practical service experience of SaaS version of EDR accumulated over the past ten years, 360 EDR supplements the traditional terminal security products’ defense against advanced threats by continuously monitoring terminal activity behavior, detecting security risks, deeply investigating threat risks, and providing remedial response methods. Insufficient, it can compress the attacker’s attack time in the fight against advanced threats, reduce the possibility that the advanced threats will eventually achieve their goals, and obtain a faster and more efficient defense effect.

Three Product Advantages Efficiently Respond to Cyber ​​Threats

In 2013, Gartner first proposed the concept of endpoint threat detection and response, which is considered as a future-oriented endpoint security solution. Unlike traditional signature detection or heuristic technology, EDR improves detection technology to a new level by observing behavior. level. For many consecutive years, EDR has been listed as one of the top ten technologies by Gartner.

Since the 360 ​​terminal security product released the cloud main defense system in 2011, after more than ten years of offensive and defensive combat with various Trojans and APT families, it has continued to polish the malicious behavior detection and response capabilities of the terminal, and has accumulated comprehensive and detailed terminal behavior detection technology. Created an industry benchmark in terms of product performance. Since the beginning of this year, it has intercepted 360,000 phishing attacks, 12 million botnet attacks, 380,000 web page vulnerability attacks, tens of thousands of ransomware attack IPs, and tens of millions of server weak password scans, etc., which has become an important tool for solving digital security problems. .

The 360 ​​EDR released this time is a new generation of terminal security products driven by threat intelligence. It adopts a complete terminal security monitoring solution and has three major product advantages: accurate detection, rapid source traceability, and efficient operation and maintenance.

Precise detection:

360 EDR provides real-time threat big data logs and alarms from terminals, integrates machine learning technology, fits user business scenarios, continuously optimizes behavior detection and response models, continuously improves monitoring capabilities and accuracy, and quickly discovers and responds to security risks encountered by enterprises ;

Quick traceability:

360 EDR core detection center analyzes massive multi-heterogeneous data through various detection and analysis technologies, ensuring comprehensive visibility and rapid source traceability of various threats;

Efficient operation and maintenance:

360 EDR synchronization supports manual and timed triggering of automated processes to improve the efficiency of security threat disposal. Combined with data analysis, chart analysis, etc., it can comprehensively present a visual host threat attack link graph, helping users to implement risky hosts in complex networks. Second-level positioning, greatly reducing operation and maintenance costs.

Turn passive into active and keen to “sniff” advanced threats

From the “Stuxnet” virus to the “Powergate Incident” in Ukraine, from the “Prism Gate” to the “Eternal Blue” incident, as well as the “Manling Flower”, “Sea Lotus” and “Sapphire Mushroom” APT attacks against my country etc., which fully shows that most advanced network attacks will use undisclosed vulnerabilities on the operating system to achieve blasting against various terminal devices through long-term latent, continuous penetration, and more concealed attack methods. Traditional terminal security protection software based on existing experience or known characteristics for passive defense often faces failure in the face of zero-day vulnerability attacks.

In order to reduce unknown advanced threat attacks such as countries, cities, industries, enterprises and institutions, 360 EDR has built a comprehensive advanced threat protection barrier that integrates “advanced attack discovery, lateral penetration protection, fileless attack protection, and software hijacking protection”.

Among them, in terms of advanced attack discovery, 360 EDR integrates situational awareness and source traceability analysis, and proactively discovers APT advanced persistent attack behaviors with fine-grained dynamic behavior identification, and comprehensively responds to unknown network threats; in terms of lateral penetration protection, 360 EDR has ” “Horizontal penetration” protection function, through six major defense measures, including remote service creation, remote scheduled task creation, remote registry tampering, remote WMI command execution, remote COM component invocation, and remote system tool process startup, before network attacks penetrate into the intranet 360 EDR deploys a number of security blocking strategies, establishes an in-depth protection system, blocks malicious code injection into memory in real time, and builds a fileless network for users before network attacks. The “separation wall” of threat protection; in terms of software hijacking protection, 360 EDR has multi-layered defense barriers, which can sense threat attacks at the first time, from passive defense to active defense, to achieve all-round, all-weather protection of cyberspace.

360 security brain empowerment boosts threat location and traceability

The comprehensive threat detection, analysis and traceability capabilities of 360 EDR are inseparable from the continuous empowerment of secure big data, threat intelligence and expert services provided by 360 Cloud Security Brain. Based on 16 years of actual combat experience, 360 has accumulated security big data with a total storage volume exceeding 2EB, as well as the world’s unique actual combat attack and defense sample database. The total number of sample files has reached 30 billion, and it has cultivated the world’s top network attack and defense expert team.

Under this, 360 EDR can use the behavioral characteristics and environmental characteristics of popular APTs to conduct in-depth correlation analysis and manual hunting investigation of real-time behavioral data, and can accurately locate and trace various network threats. Up to now, it has helped 360 capture 46 national-level hackers abroad, and monitored more than 3,600 attacks involving more than 20,000 attack targets.

Under the wave of digital transformation, security issues have escalated into complex security challenges such as big data security, cloud security, IoT security, new terminal security, network communication security, supply chain security, and application security. EDR, with its unique advantages, has become the main means to solve terminal security pain points. As a leader in digital security, 360 Government and Enterprise Security Group launched a new generation of terminal detection and response system this time, which will establish a security capability for countries, cities, industries, and enterprises to better meet business needs and efficiently respond to advanced cyber threats. The comprehensive defense level of my country’s cyberspace.

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Design of dual-drive electric vehicle control system based on LPC2132

“The paper analyzes the drive control of brushless DC motor in detail, and designs a dual rear-wheel drive control system for electric vehicles based on ARM7 LPC2132 microprocessor. The intelligent controller can realize electric vehicles such as forward, backward, automatic cruise, and Electronic differential. The basic functions of the car, and the hardware has the functions of motor overcurrent protection, battery undervoltage protection and serial communication, which well meet the actual use requirements.

“

Abstract: The paper analyzes the drive control of the brushless DC motor in detail, and designs a dual rear-wheel drive control system for electric vehicles based on the ARM7 LPC2132 microprocessor. The intelligent controller can realize the forward, backward, automatic cruise and electronic differential of the electric vehicle. It can basically perform functions such as electric vehicles, and the hardware has functions such as motor overcurrent protection, battery undervoltage protection and serial communication, which well meet the actual use requirements.

1 Overview

Today’s lack of petroleum resources and the urgent needs of environmental protection have put forward new requirements for the development of the automobile industry, that is: low noise, zero emission and energy saving. The most important way for sustainable development, and the electric vehicle driven by the in-wheel motor can not only eliminate the mechanical wear and loss in the traditional transmission, improve the transmission efficiency, but also have the advantages of small size and light weight, so that while improving the efficiency, the wheel The space can also be effectively used, which is more conducive to the realization of mechatronics and modern control technology; ARM7 series microprocessors, as 32-bit embedded processors, are characterized by their extremely high performance, low power consumption, abundant on-chip resources, and small size. It has been widely used in mobile phones, handheld computers, automobiles and other fields, and has become a processor with great market competition and prospects. This design scheme is based on PHILIPS’ ARM7TDMI-STM processor LPC2132, which controls two wireless The brushed DC motor realizes the independent drive of the two rear wheels of the electric vehicle, and the control system is designed reliably to ensure the stability of the system, and finally verified in practice.

2. Brushless DC motor and drive control

The brushless DC motor is composed of the rotor position sensor, the motor body and the electronic switch circuit. Its working principle is as follows: the position of the rotor is dynamically detected by the position sensor (Hall sensor), and the switch tube is controlled according to the position signal. It is turned on or off to control the energization and de-energization of the stator winding, which realizes the electronic commutation function and makes the motor run continuously.

Figure 1 is a three-phase connected full-bridge drive circuit, in which the switch tubes Q1, Q3, and Q5 are P-channel MOSFET power tubes. When the gate is low, the MOSFET tubes are turned on, and VD1, VD3, and VD5 are the corresponding protection diodes; Tube Q2.Q4.Q6 adopts N-channel MOSFET power tube. When the gate is high, the MOSFET tube is turned on, and VD2.VD4.VD6 is the corresponding protection diode. The three output ends of the position sensor control Q1 through a specific logic circuit. -Q6 switch tube works (on or off), there are two control methods: “three-three conduction mode”

And the “two-two conduction mode”. The windings driven by the full bridge are divided into star connection and angular connection, and the connection method is shown in Figure 2.

Three-to-three conduction mode “means that three switches are turned on at the same time each time. In Figure 1, the conduction sequence of each switch is: Q1.Q2.Q3CQ2.Q3.Q4CQ3.Q4.Q5CQ4.Q5. Q6CQ5.Q6.Q1CQ6.Q1.Q2. “Three-three conduction mode” can be divided into six control modes in actual work. The conduction state is changed every 60°, and a switch tube is replaced every time the state is changed. Each switch is turned on for 180°. In each state, the magnitude of the combined torque is 1.5 times that of the single-phase torque.

In this paper, the three-phase full-bridge star connection is used, and the “three-three conduction mode” is adopted. The conduction or cut-off of the MOSFET in the drive circuit is controlled by the corresponding software, that is, the corresponding MOSFET is extracted according to the detection signal of the position sensor. The corresponding control word of the tube is controlled, and the MOSFET tube is controlled by a specific logic circuit to realize the on or off control of the MOSFET tube, so as to realize the commutation control of the brushless DC motor, so that the motor can run continuously. The control of the motor direction is only the above The conduction sequence of the power MOSFET is different, that is, the extracted control word is different. The speed control of the brushless DC motor can use the PWM (pulse width modulation) method to control the energization current of the motor, which will not be described in detail here.

3. Hardware design of dual-drive electric vehicle control system

The design idea of ​​the control system in this paper is to use one CPU to control two brushless DC motors, which is designed to realize the independent driving of the rear wheels of the electric vehicle. In the electric vehicle control system, the control system is mainly responsible for the two brushless DC motors. Motor speed regulation of the motor. Forward and reverse control, start and stop control and other functions. Here LPC2132 from PHILIPS’ LPC2100 series is used as the central processing unit.

LPC2132 is a microcontroller based on a 32-bit ARM7TDMI-STMCPU that supports real-time simulation and tracking, with embedded high-speed 64K-byte Flash memory, a wide range of serial communication interfaces and rich on-chip resources (such as 32-bit timer x4 10-bit 8-channel ADC and 10-bit DAC, plus 47 general-purpose I/O ports and 9 edge or level-triggered external interrupt sources) make it have powerful processing functions, and has a very high Strong anti-interference ability, especially suitable for industrial control. The overall block diagram of the intelligent control system for electric vehicles is shown in Figure 3, and the hardware design diagrams of several functions are given below.

3.1 Power Design

The power supply of this control system is provided by 4 12V large-capacity lead-acid batteries connected in series to provide 48V direct current, and the working voltage in the system is also +3.3V, +5V and +15V, so the commonly used regulated power supply chip LM7824.LM7815 is used. 1117-3.3 and 1117-5 generate the required voltages, which are reliable, stable and simple. As shown in Figure 4.

The Links:   TPS51125RGER   CM100DU-12F-300G

Semiconductor test time is the cost?Teradyne reveals its big killer

From design to manufacturing, to packaging and testing of chips, a lot of manpower, material resources and financial resources are spent in the process of turning sand into gold. The quality, performance, and yield of each link need to be strictly controlled. As we all know, simple chip testing cannot add functions to the chip, nor can it improve the performance of the chip. However, chip testing runs through the entire process from semiconductor R&D to mass production, and becomes an inevitable part of semiconductor manufacturing. Chip testing mainly includes wafer testing CP and finished product testing FT. Through the testing, manufacturers can find chip design and manufacturing problems in a timely manner, thereby improving chip production yield and ensuring delivery quality.

In the semiconductor test equipment market, ATE test equipment occupies two thirds of the semiconductor test equipment. Among them, Teradyne and Advantest have the strongest technical strengths, controlling 90% of the global semiconductor test equipment market share. Teradyne has strong technology accumulation and a complete semiconductor test solution to continuously ensure chip quality and reduce customer test costs. According to Huang Feihong, deputy general manager of Teradyne sales, Teradyne has launched a variety of test platforms for SoC testing, including J750, UltraFLEX, EAGLE TEST SYSTEM and other series of test equipment.

In Huang Feihong’s view, to a certain extent, the test time is equivalent to the test cost. Therefore, how to improve chip test efficiency and reduce test costs has become an urgent problem to be solved in the current semiconductor market. On the basis of UltraFLEX test equipment, Teradyne launched UltraFLEXplus, which adopts a new PACE architecture and combines with IG-XL software to add another weapon to the semiconductor test market.

Chip technology continues to drop, and test challenges become increasingly prominent

From the perspective of the evolution of the semiconductor process technology, it can be roughly divided into three eras. It can be seen that from 1990 to 2025, semiconductor technology has gradually dropped from 0.8um to 3nm or even 2nm. With the continuous evolution of semiconductor technology, chip sizes have become smaller and smaller, and the integration of on-chip transistors has become higher and higher. This means that more simulation, data transmission and interface functions are integrated on the chip. Correspondingly, chip testing technology has also evolved continuously to meet the increasingly complex functional requirements of chips.

“The evolution of advanced technology has brought about an increase in test time.” Huang Feihong pointed out that the ever-increasing chip scale continues to increase the complexity of chip design, and the test requirements for SCAN, BIST, and standardized interfaces have also increased. Take the processor chip as an example. SCAN and BIST tests are the standards for testing the maturity of the process. The smaller the process size, the longer the test time. For analog and RF chips, Trimming testing takes up more and more time.

In addition, single-station testing seriously slows down the chip testing speed and lengthens the testing time, resulting in a high proportion of the testing cost in the overall chip price. The more advanced technology goes down, the higher the requirements for parallel testing capabilities of test equipment. However, when the process drops below 10nm, the growth rate of the number of transistors has far exceeded the update speed of chip test technology, and the interface boards and test stations cannot be increased indefinitely. ATE test equipment is facing a new round of challenges.

“Another challenge (faced by ATE test equipment) is that as the process size is reduced to 10nm and below, the yield of wafers in initial mass production continues to decline.” Huang Feihong said that the die size has changed from the original die size. 200mm2 has increased to 800mm2, and the corresponding failure density has also been increasing. For a die size of 800mm2, the yield rate of wafers in the initial mass production under the 10nm process is less than 10%.

The underlying architecture is upgraded to reduce cost and increase efficiency for chip testing

Faced with more complex mobile phones, processors, radio frequency and other chips, Teradyne launched the UltraFLEXplus high-performance SoC test platform. On the basis of the UltraFLEX series test platform, the platform has a new design of the detector interface board and adopts the PACE multi-controller architecture for the first time. “From J750 to UltraFLEX to UltraFLEXplus, Teradyne has adopted a unified software platform IG-XL.” In Huang Feihong’s view, this is also Teradyne's biggest competitive advantage. The testing procedures are fully compatible, which directly improves engineers. Development efficiency.

Different from the previous generation interface board design, UltraFLEXplus adopts the new Broadside technology, the interface board size increases, and the number of PCB layers will be significantly reduced by 20%. “If there are many PCB layers, the processing difficulty will bring greater failure rate.” On the other hand, the new interface board pins are symmetrically distributed, the layout is clearer, and the winding length is effectively reduced, which can effectively reduce the PCB Board design requirements have greatly improved signal integrity and power integrity, and parallel testing capabilities have also been improved.

"The PACE multi-controller architecture is a unique architecture of the UltraFLEXplus test platform, which can decentralize computing power and improve processing efficiency." Huang Feihong said that the PACE architecture uses the intermediate workstation master control to decentralize all computing power to each board. Each board has an independent CPU to execute instructions and measurement calculations. In addition, UltraFLEXplus is equipped with a third-generation digital board. It adopts an open, scalable, and distributed computing architecture, which can improve test efficiency as a whole. Combined with the IG-XL software platform, it reduces engineering development time by 20% and can be more Develop a more optimized test program in less time.

Write at the end

According to Huang Feihong, the global installed capacity of the UltraFLEX test platform has reached 5,000 sets, and the installed capacity of the IG-XL software platform has exceeded 12,000. Since 2020, the global installed capacity of UltraFLEXplus has also been close to 600, and it has been installed and used in two major foundries and five OSATs. Teradyne has a wealth of experience in market verification. Within one and a half years after the launch of the new UltraFLEXplus platform, it has been widely praised by major customers and is used in the field of digital computing chips.

The Links:   AC121SA01   SKKT132-16

Xilinx and Continental jointly build the automotive industry’s first mass-produced 4D imaging radar for autonomous driving

Beijing, China, September 24, 2020 – Xilinx, Inc. (NASDAQ: XLNX), the global leader in adaptive and intelligent computing, and Continental today announced that Xilinx will use Zynq®UltraScale+™ The MPSoC platform supports Continental in the development of the new Advanced Radar Sensor (ARS) 540, the first mass-produced 4D imaging sensor for the automotive industry. The cooperation between the two parties will enable new models equipped with ARS540 to achieve SAE J3016 L2 capabilities, paving the way towards L5 autonomous driving systems.

Figure: Xilinx and Continental jointly build the automotive industry’s first mass-produced 4D imaging radar for autonomous driving

4D imaging radar can determine the position of objects through range (Range), azimuth (Azimuth), elevation (Elevation) and relative speed to provide detailed driving environment information, which is unprecedented for automotive radar systems that can only collect speed and orientation information. Brand new feature. Continental’s ARS540 is a high-end long-range 4D imaging radar with high resolution and a detection range of up to 300 meters. Its wide field of view of ±60° enables Multiple Hypothesis Tracking (MHT), providing accurate predictions during driving, which is crucial for handling complex driving scenarios, such as detecting traffic jams under bridges. In addition, the ARS540 system has higher horizontal and vertical resolution to detect and respond appropriately to potentially hazardous objects on the road. In addition, the ARS540 fully demonstrates the application scalability of this sensor by supporting SAE L2 where a human driver is responsible for overseeing vehicle control and extending to fully autonomous L5 fully autonomous driving.

“The Xilinx Zynq UltraScale+ MPSoC platform provides us with the high performance and advanced DSP capabilities we need to implement the ARS540, with flexibility and market-leading network interface options,” said Norbert Hammerschmidt, Head of Radar Program Management at Continental. Capable of handling large amounts of antenna data at extremely high aggregate transfer rates. Continental has recently won a number of designs from leading European and American OEMs, and is in ongoing discussions with other OEMs around the world to adopt the ARS540. We are working with Xilin to continue to grow We are proud to bring this potentially life-saving technology to market."

The Xilinx Automotive Grade (XA) Zynq UltraScale+ MPSoC is a highly flexible, adaptive processor platform that supports Continental’s 4D imaging radar from multiple sensor platform configurations and flexibly adapts to a variety of OEMs Specification standard. The parallel processing capabilities in the device’s programmable logic provide optimal performance, enabling fully independent concurrent processing pipelines that are critical in the ARS540 4D sensing. In addition, a number of digital signal processing slices (DSP Slices) provide hardware acceleration for the implementation of real-time radar sensor inputs.

Cédric Malaquin, Technology & Market Analyst, RF Devices & Technologies Division, Yole Dévelopement (Yole) commented: “4D imaging radars offer greater detection range, wider field of view and deeper perception, while being a L5 developers provide systems and critical sensors to help them drive safer environments. We expect 4D imaging radar to first appear in limousines and autonomous taxis, a market size of over $550 million, and by 2020 A compound annual growth rate (CAGR) of 124% through 2025. By co-developing this new sensing modality, Xilinx and Continental, two innovative market leaders, have a great opportunity. “(1)

Willard Tu, Senior Director of Automotive at Xilinx, added: “We are proud to support the industry’s first production version of 4D imaging radar. By incorporating this advanced technology into passenger cars, the Continental ARS540 offers extraordinary features , which will accelerate the wider adoption of autonomous driving. Continental's longstanding experience in radar combined with Xilinx's extensive experience in adaptive chips has resulted in this extremely powerful solution."

The Links:   CM75DY-24H   SP14Q002-A1